GIGABYTE G363-SR0 (rev. AAX1) - 6NG363SR0DR000AAX1
NVIDIA-Certified Systems™ - Data Center Servers NVIDIA HGX™ H100 4- GPU 4th-generation NVIDIA® NVLink™ 900GB/s Dual 5th/4th Gen Intel® Xeon® Scalable Processors Dual Intel® Xeon® CPU Max Series 8-Channel DDR5 RDIMM, 16 x DIMMs Dual ROM Architecture 2 x 10Gb/s LAN ports via Broadcom® BCM57416 2 x 1Gb/s LAN ports via Intel® I350-AM2 8 x 2.5" Gen5 NVMe/SATA/SAS hot-swap bays 1 x M.2 slot with PCIe Gen4 x4 interface 6 x LP PCIe Gen5 x16 slots 2+1 3000W 80 PLUS Titanium redundant power supplies
We also offer six months of free collocation in our TIER III data center.
Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.
| Product code | 202.181083 |
|---|---|
| Part number | 6NG363SR0DR000AAX1 |
| Manufacturer | GIGABYTE |
| Availability | On demand |
| Warranty | 36 months |
| Weight | 70 kg |
Server system integrator & worldwide shipping
Personal approach and tailor-made servers
NBD warranties & cross-shipping
Private cloud infrastructure
Pre-sales & After-sales support
Detailed information
Rack servers
Highly flexible, scalable rack servers optimized for demanding applications in data centers. Rack density from 1U to 5U, servers are designed for single and multi-socket varieties of x86 processors from AMD and Intel as well as for ARM processors from Ampere.
Applications Include
Big Data
High Performance Computing (HPC)
Hyper-converged infrastructure (HCI)
Software-defined Storage (SDS)
Virtualization
Only the best with GIGABYTE
Strong R&D and forward ideas to deliver the values that can help you succeed in the future.
High Performance
Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding CPU workloads. All the latest technology is supported.
Compute Density
One single socket solution can outperform many dual CPU servers. Dual socket models also support up to hundreds of cores in a 1U-5U chassis. More compact performance.
Fast & Stable Connectivity
Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for newest PCIe generation.
Modularity
Building block designs allow new models to quickly reach the market. Users can now have BMC on a OCP module customized by GIGABYTE.
Collaboration
GIGABYTE and its partners have maintained a healthy relationship that values shared knowledge in order to get the latest technology into data centers.
Optimal Price
A broad portfolio of servers and products allows customers to only select the features they require which results in a lower total cost of ownership (TCO).
AI Server
AI servers power model training and real-time inference, accelerating AI application development and deployment. With robust computing power, high scalability, and optimized efficiency, they empower businesses to deliver fast and effective AI solutions.
| Dimensions | |
| Form Factor | 3U |
| Server Dimensions( WxHxD ) | 448 x 130 x 800 mm |
| Packaging Dimensions | 1176 x 782 x 295 mm |
| Motherboard | |
| Part Name | MS63-HD2 |
| Processor | |
| CPU | 5th Generation Intel® Xeon® Scalable Processors 4th Generation Intel® Xeon® Scalable Processors Intel® Xeon® CPU Max Series |
| Socket | LGA 4677 |
| QTY | 2 |
| Chipset | Intel C741 |
| System Memory | |
| Memory Type | RDIMM DDR5 |
| Memory Frequency | 5th Gen Intel® Xeon®: RDIMM: Up to 5600 MT/s 4th Gen Intel® Xeon®: RDIMM: Up to 4800 MT/s Intel® Xeon® Max Series: RDIMM: Up to 4800 MT/s |
| Memory Slots | 16 |
| Storage | |
| Disk Bays | Front hot-swap: 8 x 2.5" Gen5 NVMe/SATA/SAS SAS card is required to support SAS drives. |
| M.2 | Internal M.2 (CMTP192): 1 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0 |
| PCI Express | |
| Riser Card CRSH01R | 1 x LP x16 (Gen5 x16), from CPU_0 |
| PCIe Cable | 1 x LP x16 (Gen5 x16), from CPU_1 |
| OCP | 1 x OCP NIC 3.0, from CPU_0, disabled |
| Rear | 4 x LP x16 (Gen5 x16), from PEX89144, support RDMA (Equipped with full-height brackets) |
| Input / Output | |
| LAN | Front (I/O board - CLBH160): 2 x 1Gb/s LAN (1 x Intel® I350-AM2) - Support NCSI function (by switch setting) 1 x 10/100/1000 Mbps Management LAN Rear: 2 x 10Gb/s LAN (1 x Broadcom® BCM57416) - Support NCSI function (by switch setting) Rear (MLAN board - CDB66): 1 x 10/100/1000 Mbps Management LAN |
| Video | 1 x Mini-DP |
| Backplane Board | |
| Backplane Board | PCIe Gen5 x4 or SATA 6Gb/s or SAS 12Gb/s |
| Security Modules | |
| TPM | 1 x TPM header with SPI interface - Optional TPM2.0 kit: CTM010 |
| Power Supply | |
| Certification | 80 PLUS Titanium |
| Power | 3000W |
| QTY | 2+1 |
| Environment Properties | |
| Operating | Temperature: 10°C to 35°C Humidity: 8%-80% (non-condensing) |
| Non-operating | Temperature: -40°C to 60°C Humidity: 20% to 95% (non-condensing) |
Parameters
| Size in U | 3 |
|---|---|
| Depth (mm) | 800 |
| CPU manufacturer | Intel |
| Socket | 4677 |
| HDD disks | 9 |
| 2.5" Drive bays | 8 |
| 3.5" Drive bays | 0 |
| NVMe slots | 9 |
| Total amount of PCIe | 6 |
| OCP/AIOM | 1 |
| Power (W) | 3000 |
| Efficiency certification | Titanium |
