Gigabyte XV24-AX0 (rev. IAJ1) - 6NXV24AX0DR000IAJ1
Immersion Cooling Server NVIDIA MGX™ modular server design Supports up to 4 x Dual slot Gen5 GPUs Dual Intel® Xeon® 6900-Series Processors 12-Channel DDR5 RDIMM / MRDIMM, 24 x DIMMs Dual ROM Architecture 2 x 10Gb/s LAN ports via Intel® X550-AT2 6 x 2.5" Gen5 NVMe hot-swap bays 2 x M.2 slots with PCIe Gen5 x2 interface 4 x FHFL PCIe Gen5 x16 slots for GPUs 3 x FHFL PCIe Gen5 x16 slots 4 x 2000W 80 PLUS Titanium redundant power supplies
We also offer six months of free collocation in our TIER III data center.
Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.
| Product code | 202.181470 |
|---|---|
| Part number | 6NXV24AX0DR000IAJ1 |
| Manufacturer | GIGABYTE |
| Availability | On demand |
| Warranty | 36 months |
| Weight | 60 kg |
Server system integrator & worldwide shipping
Personal approach and tailor-made servers
NBD warranties & cross-shipping
Private cloud infrastructure
Pre-sales & After-sales support
Detailed information
Rack servers
Highly flexible, scalable rack servers optimized for demanding applications in data centers. Rack density from 1U to 5U, servers are designed for single and multi-socket varieties of x86 processors from AMD and Intel as well as for ARM processors from Ampere.
Applications Include
Big Data
High Performance Computing (HPC)
Hyper-converged infrastructure (HCI)
Software-defined Storage (SDS)
Virtualization
Only the best with GIGABYTE
Strong R&D and forward ideas to deliver the values that can help you succeed in the future.
High Performance
Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding CPU workloads. All the latest technology is supported.
Compute Density
One single socket solution can outperform many dual CPU servers. Dual socket models also support up to hundreds of cores in a 1U-5U chassis. More compact performance.
Fast & Stable Connectivity
Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for newest PCIe generation.
Modularity
Building block designs allow new models to quickly reach the market. Users can now have BMC on a OCP module customized by GIGABYTE.
Collaboration
GIGABYTE and its partners have maintained a healthy relationship that values shared knowledge in order to get the latest technology into data centers.
Optimal Price
A broad portfolio of servers and products allows customers to only select the features they require which results in a lower total cost of ownership (TCO).
Edge Server
Real-time data processing at the source reduces latency for real-time analytics, IoT, and 5G networks. These servers are deployed in compact locations and are designed to continue running even when internet connection is lost.
| Dimensions | |
| Form Factor | 2U |
| Server Dimensions ( WxHxD ) |
438 x 87 x 900 mm |
| Packaging Dimensions | 1196 x 744 x 400 mm |
| Motherboard | |
| Part Name | MAX4-MG0 |
| Processor | |
| CPU | Intel® Xeon® 6 Processors Intel® Xeon® 6900-Series Processors |
| Socket | LGA 7529 |
| QTY | 2 |
| Chipset | System on Chip |
| System Memory | |
| Memory Type | RDIMM / MRDIMM DDR5 |
| Memory Frequency | 6400 / 8800 MTs |
| Memory Slots | 24 |
| Storage | |
| Disk Bays | 6x 2.5" NVMe Gen5 Hot-Swap |
| M.2 | 2x M.2 (2280/22110) PCIe Gen5 x2 |
| RAID | Onboard VROC key header |
| PCI Express | |
| PCIe | 7x FHFL Gen5 x16 |
| Input / Output | |
| LAN | 2x 10Gbs LAN (1 x Intel® X550-AT2) 1x 10/100/1000 Mbps Management LAN |
| USB | 2x USB 3.2 Gen1 |
| Video | 1x Mini-DP |
| Backplane Board | |
| PCIe Gen5 x4 | |
| Security Modules | |
| TPM | 1 x TPM header with SPI interface *Optional TPM2.0 kit: CTM012 |
| Other | 1 x PRoT connector *only enabled on RoT SKU |
| Power Supply | |
| Certification | 80 Plus Titanium |
| Power | 2000 W |
| QTY | 4 |
| Environment Properties | |
| Operating | Coolant temperature: 20°C to 35°C |
| Non-operating | Temperature: -40°C to 60°C Humidity: 20% to 95% (non-condensing) |
Parameters
| Size in U | 2 |
|---|---|
| Depth (mm) | 900 |
| CPU manufacturer | Intel |
| Socket | 7529 |
| HDD disks | 8 |
| 2.5" Drive bays | 6 |
| 3.5" Drive bays | 0 |
| NVMe slots | 6 |
| Total amount of PCIe | 7 |
| OCP/AIOM | 0 |
| Power (W) | 2000 |
| Efficiency certification | Titanium |
