GIGABYTE H273-Z85-AAW1 (rev. 3.x) - 6NH273Z85DR000ACW1
2U 4-node rear access server system Dual AMD EPYC™ 9005/9004 Series Processors per node 12-Channel DDR5 RDIMM, 24 x DIMMs per node Dual ROM Architecture 8 x 1Gb/s LAN ports via Intel® I350-AM2 8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays 4 x M.2 slots with PCIe Gen4 x4 interface (optional) 4 x LP PCIe Gen5 x16 slots Dual 3000W 80 PLUS Titanium redundant power supply
We also offer six months of free collocation in our TIER III data center.
Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.
| Product code | 202.181697 |
|---|---|
| Part number | 6NH273Z85DR000ACW1 |
| Manufacturer | GIGABYTE |
| Availability | On demand |
| Warranty | 36 months |
| Weight | 55 kg |
Server system integrator & worldwide shipping
Personal approach and tailor-made servers
NBD warranties & cross-shipping
Private cloud infrastructure
Pre-sales & After-sales support
Detailed information
Rack servers
Highly flexible, scalable rack servers optimized for demanding applications in data centers. Rack density from 1U to 5U, servers are designed for single and multi-socket varieties of x86 processors from AMD and Intel as well as for ARM processors from Ampere.
Applications Include
Big Data
High Performance Computing (HPC)
Hyper-converged infrastructure (HCI)
Software-defined Storage (SDS)
Virtualization
Only the best with GIGABYTE
Strong R&D and forward ideas to deliver the values that can help you succeed in the future.
High Performance
Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding CPU workloads. All the latest technology is supported.
Compute Density
One single socket solution can outperform many dual CPU servers. Dual socket models also support up to hundreds of cores in a 1U-5U chassis. More compact performance.
Fast & Stable Connectivity
Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for newest PCIe generation.
Modularity
Building block designs allow new models to quickly reach the market. Users can now have BMC on a OCP module customized by GIGABYTE.
Collaboration
GIGABYTE and its partners have maintained a healthy relationship that values shared knowledge in order to get the latest technology into data centers.
Optimal Price
A broad portfolio of servers and products allows customers to only select the features they require which results in a lower total cost of ownership (TCO).
High Density
Multi-node servers enhance performance by distributing workloads across nodes, ensuring reliability and scalability. Key benefits include redundancy, simplified management, lower TCO, and improved efficiency.
| Dimensions | |
| Form Factor | 2U 4-Node Rear access |
| Server Dimensions ( WxHxD ) |
440 x 87.5 x 877 mm |
| Packaging Dimensions | 1184 x 706 x 394 mm |
| Motherboard | |
| Part Name | MZ83-HD2 |
| Processor | |
| CPU | AMD EPYC™ 9005 Series Processors AMD EPYC™ 9004 Series Processors |
| Socket | SP5 |
| QTY | 8 |
| Chipset | System on Chip |
| System Memory | |
| Memory Type | RDIMM DDR5 |
| Memory Frequency | AMD EPYC™ 9005: 6400 MTs AMD EPYC™ 9004: 4800 MTs |
| Memory Slots | 96 |
| Storage | |
| Disk Bays | 8x 2.5" Gen5 NVMe/SATA/SAS-4 Hot-Swap |
| M.2 | 4x M.2 (2280/22110) PCIe Gen4 x4 *Optional |
| PCI Express | |
| PCIe | 4x LP Gen5 x16 |
| Input / Output | |
| LAN | 8x 1 Gbps LAN (4 x Intel® I350-AM2) 4x 10/100/1000 Mbps Management LAN |
| USB | 8x USB 3.2 Gen1 |
| Video | 4x Mini-DP |
| Backplane Board | |
| PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s |
|
| Security Modules | |
| TPM | 1x TPM header with SPI interface *Optional TPM 2.0 kit: CTM010 |
| Power Supply | |
| Certification | 80 PLUS Titanium |
| Power | 3000 W |
| QTY | 2 |
| Environment Properties | |
| Operating | Temperature: 10°C to 35°C Humidity: 8% to 80% (non-condensing) |
| Non-operating | Temperature: -40°C to 60°C Humidity: 20% to 95% (non-condensing) |
Parameters
| Size in U | 2 |
|---|---|
| Depth (mm) | 877 |
| CPU manufacturer | AMD |
| Socket | SP5 |
| HDD disks | 12 |
| 2.5" Drive bays | 8 |
| 3.5" Drive bays | 0 |
| NVMe slots | 8 |
| Total amount of PCIe | 4 |
| OCP/AIOM | 0 |
| Power (W) | 3000 |
| Efficiency certification | Titanium |
